Structure and Specifications
The JSP-8080 series adopts a vertical front-opening chamber design with an internal dimension of Φ800 × 800 mm (H). This size is suitable for medium-sized substrates, making it ideal for research institutes, laboratories, and enterprise R&D departments engaged in thin film process development or small-scale production. The system is equipped with a bottom-mounted rotating substrate holder that supports both self-rotation and planetary rotation with adjustable speed. This compound rotation ensures that the substrate surface receives particle bombardment from multiple angles, resulting in films with superior thickness uniformity and high density.
Target and Process Configuration
The system is equipped with four rectangular planar magnetron targets, allowing flexible combinations of materials for co-sputtering or multilayer deposition.
JSP-8080A: Configured with one HiPIMS high-power pulsed power supply, one DC power supply, one dual-pulse mid-frequency power supply, and one RF bias power supply. It also includes a high-efficiency ion source to further enhance film density, improve adhesion, and enable surface functionalization.
JSP-8080B: Configured with two DC power supplies and one dual-pulse mid-frequency power supply. This setup provides excellent stability and compatibility for both metallic and insulating materials, balancing performance with cost efficiency.
Examples of Depositable Materials
The system supports a wide range of metallic, ceramic, and oxide targets, including:
Metals: titanium (Ti), aluminum (Al), stainless steel (SUS), chromium (Cr), molybdenum (Mo), copper (Cu), gold (Au), silver (Ag).
Nitrides: titanium nitride (TiN), chromium nitride (CrN), titanium aluminum nitride (TiAlN), zirconium nitride (ZrN).
Oxides: indium tin oxide (ITO), aluminum oxide (Al₂O₃), zinc oxide (ZnO), silicon dioxide (SiO₂), titanium dioxide (TiO₂).
Carbon-based coatings: diamond-like carbon (DLC), tungsten carbide/carbon (WC/C).
Composite materials: copper-nickel (Cu-Ni), titanium-silicon (Ti-Si), and other multi-element targets.
Vacuum and Control System
The system employs a high-performance turbomolecular pump set capable of rapidly achieving and maintaining an excellent high-vacuum environment, effectively minimizing impurities and oxidation. The fully automated control platform integrates precise parameter setting and real-time monitoring for key variables such as target power, gas flow rate, chamber pressure, and deposition rate. All process data can be automatically recorded, ensuring full traceability and high reproducibility for both research and production applications.
Application Fields
The JSP-8080 is suitable for various thin film applications, including:
Hard coatings — Enhancing hardness and lifespan of tools, molds, and wear-resistant components (e.g., TiN, CrN, TiAlN).
Anti-friction coatings — Surface modification for bearings, sliders, and frictional components (e.g., DLC, WC/C).
Functional coatings — For conductive, anti-corrosion, electromagnetic shielding, and infrared-reflective purposes.
Decorative coatings — Providing metallic luster or colorful appearances for watches, mobile housings, and automotive parts.
Oxide coatings — Used in optoelectronic devices, sensors, solar cells, and display glass (e.g., ITO transparent conductive films, ZnO varistor films, Al₂O₃ protective layers).
With outstanding process flexibility and stable deposition performance, the JSP-8080 series offers a reliable and efficient coating solution for research, laboratory, and small-scale industrial production.
